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filingDate 2016-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e33014a7b15b36a9e84dc7ec742312be
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publicationDate 2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9853030-B2
titleOfInvention Fin field effect transistor
abstract Various embodiments provide semiconductor devices and methods for forming the same. A first fin and a second fin are formed on a semiconductor substrate. A first dielectric layer is formed on the semiconductor substrate and has a top surface lower than a top surface of both of the first fin and the second fin. A gate structure is formed on the first dielectric layer and covering across a first portion of each of the first fin and the second fin. A second portion of the first fin on both sides of the gate structure is removed, forming a first recess. A first semiconductor layer is formed in the first recess. A second dielectric layer is formed on the first dielectric layer and the first semiconductor layer, and exposes a top surface of the second fin. A second semiconductor layer is formed on the exposed top surface of the second fin.
priorityDate 2013-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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