Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5fce13547122d9ba453b9d95494c9379 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10818 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10871 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10787 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-1081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-047 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-585 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3447 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-707 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-70 |
filingDate |
2017-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34eb2a730eb801e1ded4eb044f947e30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_831bfb472a4f1523a59940a7a0f8ec62 |
publicationDate |
2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9831575-B2 |
titleOfInvention |
Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same |
abstract |
A circuit board assembly may include a circuit board, a first electrical terminal, and a layer of solder paste. The circuit board may include a minimum thickness, a first side, and a second side opposite the first side. The first electrical terminal may include a solder tab. The layer of solder paste may be disposed on the first side of the circuit board. The solder tab of the first electrical terminal may extend into the first side of the circuit board but not beyond the second side of the circuit board. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10340616-B2 |
priorityDate |
2014-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |