http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9831139-B2

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filingDate 2016-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_756f2e2d87c04d94fd75bf7170e794d6
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publicationDate 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9831139-B2
titleOfInvention Test structure and method of manufacturing structure including the same
abstract A test structure for manufacturing a semiconductor device includes a test element, a first pad connected to the test element, and a second pad connected to the test element. A first wire is connected to the test element, and the first wire and the test element are part of a first layer disposed on a semiconductor substrate. A second wire is connected to the first wire, and is part of a second layer disposed on the semiconductor substrate, and the second layer is different from the first layer.
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.