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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
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filingDate 2016-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20e44c7ae91749a7929c154412cd96a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9207b4057693d168371c36d51327f91e
publicationDate 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9831085-B2
titleOfInvention Method of fabricating hafnium oxide layer and semiconductor device having the same
abstract Provided are a method of fabricating a hafnium oxide layer and a method of fabricating a semiconductor device using the same. The method of fabricating a tetragonal hafnium oxide layer includes providing a substrate and then forming an initial hafnium oxide layer on the substrate. The initial hafnium oxide layer may have an amorphous structure, a monoclinic crystal structure, or a mixed structure thereof on the substrate. Phase-changing the initial hafnium oxide layer to a tetragonal hafnium oxide layer by heating the initial hafnium oxide layer at a temperature equal to or higher than a phase change temperature to the tetragonal hafnium oxide layer, is performed. Then, the heated tetragonal hafnium oxide layer may be rapidly cooled to suppress nucleation and growth of a monoclinic hafnium oxide in the tetragonal hafnium oxide layer.
priorityDate 2015-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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