| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33f47fbf437c50deb112cc6fbd9aa5ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6190988835eaae6a1d30d28c6c000e38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2d667d426621556578196d04a30b08f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_75b939043b21b676445dcf0dfd2dd98a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12597 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1889
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-10 |
| filingDate |
2012-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8823842a2c3324134a6dea23b14771c0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_325849446cfb51bfa87c236576c7fa2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07e41cf5977586bed3e7487b1cba2844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b448bd5eb7e9ef2d644a168f8539b3f7 |
| publicationDate |
2017-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9822034-B2 |
| titleOfInvention |
Method for electroless plating |
| abstract |
The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy. |
| priorityDate |
2011-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |