Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0175 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-112 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
filingDate |
2013-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e9bf5964e96575e028e30f532fe79ce http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc979d05605a4940b2436468ce3977a5 |
publicationDate |
2017-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9814136-B2 |
titleOfInvention |
Wiring board, mounting structure equipped with the wiring board, and method for manufacturing wiring board |
abstract |
A wiring board includes a first electrically-conductive layer; and a first resin layer covering the first electrically-conductive layer, the first resin layer including a resin portion and inorganic insulating particles dispersed in the resin portion. The first resin layer has a first layer region which is in contact with one main surface and side surfaces of the first electrically-conductive layer, and a second layer region which is located on a side of the first layer region which side is opposite to the first electrically-conductive layer. The inorganic insulating particles include a plurality of first inorganic insulating particles contained in the first layer region, and a plurality of second inorganic insulating particles contained in the second layer region. A content rate of the first inorganic insulating particles in the first layer region is lower than a content rate of the second inorganic insulating particles in the second layer region. |
priorityDate |
2012-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |