| abstract |
Provided is a structure including a first member ( 2 ); a second member ( 3 ) disposed opposite to the first member ( 2 ); and a glass layer ( 4 ) disposed between the first member ( 2 ) and the second member ( 3 ) so as to bond the first member ( 2 ) and the second member ( 3 ). A glass transition point of the glass layer ( 4 ) is lower than a temperature of the glass layer ( 4 ) under operation. In the glass layer ( 4 ), at least either of ceramic and metallic particles 4 b, 4 c is dispersed. In a temperature region lower than the glass transition point of the glass layer ( 4 ), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member ( 2 ) and the second member ( 3 ). This allows thermal strain caused within the structure ( 1 ) to be reduced when the structure ( 1 ) is operated at a higher temperature than a room temperature. |