| abstract |
Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains:n (A) an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm 2 /s at 25° C., and is represented by the following average composition formula (1)n nR 1 a SiO (4-a)/2 (1)n wherein R 1 represents a hydrogen atom or at least one group selected from a hydroxy group and a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a satisfies 1.8≦a≦2.2; and (B) a silver powder having a tap density of not lower than 3.0 g/cm 3 and a specific surface area of not larger than 2.0 m 2 /g, such silver powder being in an amount of 300 to 11,000 parts by mass with respect to 100 parts by mass of the component (A). |