http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9780064-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0239
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-2076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-04953
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-04941
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-566
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
filingDate 2015-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4991177f6ac6afc07f819555fba75304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4582b8d0b8b6566c564890422a1947d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8df7798b679ef2a419b9e4dbef27542e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_273053a376d0d1f0f8370ba177cde0c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7e27afcedf24b9f4a760ef9e781f65e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aef78a6927dded860b2c5e0bcdf44e83
publicationDate 2017-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9780064-B2
titleOfInvention Method of forming package assembly
abstract A method of forming a package assembly includes forming a no-flow underfill layer on a substrate. The method further includes attaching a semiconductor die to the substrate. The semiconductor die comprises a bump and a molding compound layer in physical contact with a lower portion of the bump. An upper portion of the bump is in physical contact with the no-flow underfill layer.
priorityDate 2012-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6794761-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011278736-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007238220-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6281581-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013113094-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013075139-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013009307-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010140760-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6180696-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004012930-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609

Total number of triples: 115.