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filingDate 2009-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f7a0a8242d2d4c39768f86ee055be17
publicationDate 2017-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9771502-B2
titleOfInvention Adhesive formulation and also method for the treatment of reinforcing inserts
abstract The present invention relates to an adhesive formulation in the form of an aqueous dispersion with a solids content of 10 to 40% by weight relative to the adhesive formulation, for the treatment of reinforcing inserts for the production of reinforced polymer products, 100% by weight of the solids containingn a) 1 to 20% by weight of a bisphenol A epoxy novolak, b) 0 to 20% by weight of an entirely or partially blocked isocyanate, c) 60 to 92% by weight of a resorcinol formaldehyde latex (RFL).
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