Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_174a1a7e522ce762abefce383ef14b3e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
filingDate |
2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_813ae2841c13e5cf1d123e7abb65d811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05da1e0fed2711912d05e2be4e5331f4 |
publicationDate |
2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9691519-B2 |
titleOfInvention |
Insulating paste, electronic device and method for forming insulator |
abstract |
An insulating paste includes insulating particles 311 , Si particles 312 and an organic Si compound 320 . The organic Si compound 320 reacts with the Si particles 312 to form a Si—O bond filling up the space around the insulating particles 311. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10468376-B2 |
priorityDate |
2012-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |