Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0558 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02375 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02331 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3512 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13113 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
filingDate |
2015-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9eccdfb523c0652937b5d13a94e43cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_465309b7bc499fe1b9dbe55501293171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e50ae961cd300da4641081de81a60af9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c7e21351e98fe3d6baaa0e822116759 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cbd8fa2dd2421bafe54feaedba24ef8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55f458d34199152a5f7337399f9f5b0e |
publicationDate |
2017-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9659890-B2 |
titleOfInvention |
Methods and apparatus of packaging semiconductor devices |
abstract |
Methods and apparatuses for wafer level packaging (WLP) semiconductor devices are disclosed. A redistribution layer (RDL) is formed on a first passivation layer in contact with a conductive pad over a surface of a die. The RDL layer is on top of a first region of the first passivation layer. A second passivation layer is formed on the RDL layer with an opening to expose the RDL layer, and over the first passivation layer. An under bump metallization (UBM) layer is formed over the second passivation layer in contact with the exposed RDL layer. A second region of the first passivation layer disjoint from the first region is determined by projecting an outer periphery of a solder ball or other connector onto the surface. |
priorityDate |
2011-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |