| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G05B19-41835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-522 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G05B19-418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate |
2013-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7304b35c66945276375d4ec8cb4c3cdb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60b17f466cc8cc97417ca8179bd64704
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc92f76ae717916c7ab22d2e5d0f5bc7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_637b35587c5680319a7607d72232ea9c |
| publicationDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9632498-B2 |
| titleOfInvention |
Systems and methods of compensating for filling material losses in electroplating processes |
| abstract |
A computer-implemented system and method of compensating for filling material losses in a semiconductor process. The computer-implemented method includes determining using a computer a pattern density difference between a first circuit pattern above a semiconductor substrate and a second circuit pattern adjacent to the first pattern. A dummy pattern is inserted between the first pattern and the second pattern so as to compensate for an estimated loss of filling material induced during electrochemical plating by the pattern density difference exceeding a threshold pattern density difference. |
| priorityDate |
2013-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |