| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5fbc63f0afde52b644fa97a195aacd5b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-033 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C99-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00619
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00484 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate |
2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d73a8fcd9483faeca3264f4287b964f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_665ebbc393114f1192243d083b4833da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_492a4b199e23302f310a2017b4ee1cf8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_189d573e984cf973016f4d68953fd31e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fad19fef0082c2f59d8ed6ac0a4e76f |
| publicationDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9630836-B2 |
| titleOfInvention |
Simplified MEMS device fabrication process |
| abstract |
A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10043704-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10160641-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10199262-B2 |
| priorityDate |
2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |