Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-3425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1316 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10151 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2077-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2509-00 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0034 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-1266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-1271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14639 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K509-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C44-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C70-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C44-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C70-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
filingDate |
2014-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a56dcd4bba4f410d7995da97fa35094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_797c36a6c61107bb24f4f1800763470d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ef1479f9878580c4e723cc531ab3211 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_565f058f679eeb8b10d0ca06f7c70449 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c621ca9ad5714b9e8e1a3630d1df171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62cf09decb1c49609fb9672f49eedc21 |
publicationDate |
2017-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9623591-B2 |
titleOfInvention |
Method of encapsulating an electronic component |
abstract |
An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10836223-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023045058-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11560111-B2 |
priorityDate |
2013-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |