| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 |
| filingDate |
2013-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed4710b0f7752b3878e59272a5572b70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_236402d4f737df0878f5e680c874191a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e86e6371cf263d5e277344559d69d8b5 |
| publicationDate |
2017-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9611550-B2 |
| titleOfInvention |
Formaldehyde free electroless copper plating compositions and methods |
| abstract |
The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10590541-B2 |
| priorityDate |
2012-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |