Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-31905 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0491 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-067 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-319 |
filingDate |
2014-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db03501a6b9f568bda927ba73f0f7554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5576769f1e89580e8427935115ed242d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ce376faa8b25ff35a5d3fc23d90afa5 |
publicationDate |
2017-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9562942-B2 |
titleOfInvention |
Probe apparatus |
abstract |
A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing device 50 mounted in the probe apparatus includes a surrounding member 52 which surrounds probe needles 24 G and 24 S between a probe card 16 and a mounting table 12 ; and a gas supply device 54 configured to supply a gas to a vicinity of the probe needles 24 G and 24 S through an inside or a vicinity of the surrounding member 52 to form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needles 24 G and 24 S when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact plate 34 also serves as the surrounding member 52. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10436833-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10338101-B2 |
priorityDate |
2013-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |