| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e4589b30807b53be5b8d5c09bfad19dc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D139-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D139-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2015-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e47548a3354da6c319e11a033c131cba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aaf70f50257850eaaeac2910b2f5d7a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b56f924b21060a00a42c7704acd3c94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e52fb9fa48c131ec8d47ccb4d33054f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837c6b956ff209f16cdbb34c958aa580
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c7e1e0a58107ca9b8186004f244c93 |
| publicationDate |
2016-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9512291-B2 |
| titleOfInvention |
High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites |
| abstract |
A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10340154-B2 |
| priorityDate |
2011-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |