patent/US-9508626-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9508626-B2

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af687fe044ae3a57bd114c92fc1ec3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bccde8faf102dc15841e2b65cb63ba0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_efd9ba30c7d27a4c96fcd91b893602e3
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14335 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15331 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05599 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1434 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1431 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
classificationIPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
filingDate	2010-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2016-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b99684628fcd72bc9cb9b9a83f6b2f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af984ed47e93f67b7f68a4cf211287f0
publicationDate	2016-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-9508626-B2
titleOfInvention	Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height
abstract	A semiconductor device has a thermally-conductive frame and interconnect structure formed over the frame. The interconnect structure has an electrical conduction path and thermal conduction path. A first semiconductor die is mounted to the electrical conduction path and thermal conduction path of the interconnect structure. A portion of a back surface of the first die is removed by grinding. An EMI shielding layer can be formed over the first die. The first die can be mounted in a recess of the thermally-conductive frame. An opening is formed in the thermally-conductive frame extending to the electrical conduction path of the interconnect structure. A second semiconductor die is mounted over the thermally-conductive frame opposite the first die. The second die is electrically connected to the interconnect structure using a bump disposed in the opening of the thermally-conductive frame.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11545477-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10957679-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11625523-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11683037-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11600526-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11159166-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11159165-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11749576-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11711082-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11394386-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11309334-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886924-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11651132-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11749610-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11538763-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11264992-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10985154-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11272618-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10985760-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11637056-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11227838-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11410977-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11093677-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11107768-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11368157-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11101801-B2
priorityDate	2010-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006125113-A1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419593443 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609 http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID1520600 http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID1520600 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID518712

Total number of triples: 112.