| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d01febc2c6a37a9d533777610a54fe5f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1354
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81411
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2021-60022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4825
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49575
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4951
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49586
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49558
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2015-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26726b1aef091f9f9fee2a615baa537d |
| publicationDate |
2016-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9502337-B2 |
| titleOfInvention |
Flip-chip on leadframe semiconductor packaging structure and fabrication method thereof |
| abstract |
Flip-chip on leadframe (FCOL) semiconductor packaging structure and fabrication method thereof are provided. A semiconductor chip with copper pillars formed there-over is provided. A barrier layer is formed on the copper pillars. A solder material is coated on the barrier layer. A layer of soldering flux is coated on the solder material. A leadframe with electric leads formed thereon is provided. An insulating layer is formed an the leadframe and having a plurality of openings to expose portion of the electric leads. The semiconductor chip is placed upside down onto the leadframe to have the soldering flux in contact with the portion of the electric leads exposed in the openings. The solder material flows back to form conductive interconnections between the copper pillars and the portion of the electric leads exposed in the openings. The semiconductor chip is packaged with the leadframe using a mold compound. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3692574-A4 |
| priorityDate |
2014-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |