http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9490043-B2

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
filingDate 2012-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcec8498a9852c449431931106fab099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dd3a3e9552b89e88c11438983ce4a60
publicationDate 2016-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9490043-B2
titleOfInvention Highly conductive electrically conductive adhesives
abstract The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.
priorityDate 2011-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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