Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 |
filingDate |
2013-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2016-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_781193fbb165873a6526e2b9ae1de3ef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad7c2fd41396d4bd2284f234f9a41e24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bab368556d3b61a3365ea26123cc40a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef8c2d5fa0a9202398ef4e70de65119a |
publicationDate |
2016-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9476135-B2 |
titleOfInvention |
Electro chemical plating process |
abstract |
The present disclosure relates to an electro-chemical plating (ECP) process which utilizes a dummy electrode as a cathode to perform plating for sustained idle times to mitigate additive dissociation. The dummy electrode also allows for localized plating function to improve product gapfill, and decrease wafer non-uniformity. A wide range of electroplating recipes may be applied with this strategy, comprising current plating up to approximately 200 Amps, localized plating with a resolution of approximately 1 mm, and reverse plating to remove material from the dummy electrode accumulated during the dummy plating process and replenish ionic material within the electroplating solution. |
priorityDate |
2013-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |