| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_210b4f1db398c9e04ec46eebd7f7f1dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_16021308c1f8c80ed8e4102eb770b060
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4a20f3b3ab5e80e4f00f3caaf3d8d320
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_654f71f916a09aac805ad222e5e84cd7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2377-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F02F7-0085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249977 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-3442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E04B1-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-3457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F02F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-3446
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-0033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C67-2205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F02F7-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C44-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/E04B1-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-06 |
| filingDate |
2011-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ddf48441953ece48e9d98964241709b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e78bb0a8195831f5129068d37ba3507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c174e5916f78d84bfe35a92ffce4a897
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b93cfe970d4f848ce1eac146eca9e9bb |
| publicationDate |
2016-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9447575-B2 |
| titleOfInvention |
Polyamide resin composition, expanded polyamide resin molding, and automotive resin molding |
| abstract |
Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×10 6 g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11161284-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10457796-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019090581-A1 |
| priorityDate |
2010-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |