| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66818
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76892 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 |
| filingDate |
2015-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9555c89851044f8391d39dc6bcf97805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_336eead9b1ab5e068b044c0726bd03ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa6b8951d5a5598673048ce429d4bbb5 |
| publicationDate |
2016-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9443724-B2 |
| titleOfInvention |
Modification processing method and method of manufacturing semiconductor device |
| abstract |
A modification processing method includes preparing a substrate having a silicon layer on which a damage layer is formed through plasma processing. The method further includes removing the damage layer formed on the silicon layer by processing the substrate with a first process gas containing a fluorine gas. |
| priorityDate |
2014-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |