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publicationDate 2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9406776-B2
titleOfInvention High temperature gate replacement process
abstract A method for fabricating an integrated circuit device is disclosed. An exemplary method comprises performing a gate replacement process to form a gate structure, wherein the gate replacement process includes an annealing process; after the annealing process, removing portions of a dielectric material layer to form a contact opening, wherein a portion of the substrate is exposed; forming a silicide feature on the exposed portion of the substrate through the contact opening; and filling the contact opening to form a contact to the exposed portion of the substrate.
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