| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_459ed213007307f4e4bee9a68a346ca7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate |
2015-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a47f36bbebe96d595ab332c59b9fd85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15ca2e67b25dd5b60c655f78418c6ad0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5a016c5c7a2b7aa8f55f9f93ed9b759
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d2c3b62bc57623cb5c1ed4a3ccd184e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab5f9e8479a754c446f198346e84143b |
| publicationDate |
2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9406527-B2 |
| titleOfInvention |
Semiconductor device manufacturing method and related semiconductor wafer |
| abstract |
A method for processing a wafer (in a process of manufacturing semiconductor devices) may include the following steps: using a first slurry set to perform a first chemical mechanical polishing process on the wafer, wherein the wafer includes a plurality of metal gate structures; using a second slurry set to perform a second chemical mechanical polishing process on the wafer, wherein a concentration of a slurry material in the second slurry set is less than a concentration of the slurry material in the first slurry set; performing a cleaning process on the wafer; and providing an anti-reflective coating on the wafer. |
| priorityDate |
2014-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |