http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9396958-B2

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
filingDate 2015-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_020839d94e80841bc3220be92d33c74a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad3cd6a9161f1ac6317ad909f1863fe6
publicationDate 2016-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9396958-B2
titleOfInvention Self-aligned patterning using directed self-assembly of block copolymers
abstract Techniques herein provide methods for self-aligned etching that use existing features for patterning or registering a pattern, without damaging existing features. Existing substrate structures are used to create a surface that enables directed self-assembly (DSA) of block copolymers (BCP) without a separate lithographic patterning layer. Methods herein include recessing at least one existing material or structure on a substrate, and adding a film that remains on the recessed material only. This film can be selected to have a preferential surface energy that enables controlled self-assembly of block copolymers. The substrate can then be etched using both existing structures and one polymer material as an etching mask. One example advantage is that self-assembled polymer material can be located to protect exposed corners of existing features, which reduces a burden of selective etch chemistry, increases precision of subsequent etching, and reduces sputter yield.
priorityDate 2014-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.