| abstract |
In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal ( 4 ) of an electronic component ( 1 ) and an electrode terminal ( 5 ) of a substrate ( 2 ) contains an alloy ( 8 ) and a metal ( 9 ) having a lower modulus of elasticity than the alloy ( 8 ). The junction has a cross section structure in which the alloy ( 8 ) is surrounded by the metal ( 9 ) having the lower modulus of elasticity. |