| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ebe4f47e539fab44aa11c766b3936641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcb73089d024b06cfaaa97355349c118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7890b322ec39a93f5ee66ce68a2de618 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-1883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-7621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-18 |
| filingDate |
2013-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2127f12e738e25f77bb472b6baa5924
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88d93108dc926fd81dbcc4263cc74d0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e72a3e59aa3681605f95da9fb07d76be |
| publicationDate |
2016-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9371409-B2 |
| titleOfInvention |
Curing compositions having low-free amounts of methylenedianiline |
| abstract |
A process for preparing a curing composition of a coordination complex comprising methylenedianiline (MDA) and a salt, and less than 1000 of free MDA. The curing composition may be used in curing polyurethanes and epoxy resins. |
| priorityDate |
2009-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |