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filingDate 2012-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2016-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9349662-B2
titleOfInvention Test structure placement on a semiconductor wafer
abstract A method of fabricating integrated circuit devices is provided. The method includes forming a plurality of spaced integrated circuit dies on a semiconductor wafer and forming a dedicated test die on the semiconductor wafer adjacent the plurality of spaced integrated circuit dies, the dedicated test die including a test structure having a first width when viewed in a top view and being operable to generate wafer evaluation data. Further, the method includes forming a scribe line region interposed between the plurality of spaced integrated circuit dies, the scribe line region having a second width defined by a distance between adjacent integrated circuit dies when viewed in a top view, the second width being smaller than the first width, and the scribe line region being free of test structures.
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Total number of triples: 27.