http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9327108-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_222758f94ccc9369545661534a704b5e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-365 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0543 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-36 |
| filingDate | 2014-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5eafb5d015f67bfd90d0f17d10b33b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_380b1a240896d491603df819724397a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edef69e8d998a8f15ee8c3354d6bedbd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5e19c939eaba3a36aa9e31ddcea4aef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c97fcf178e4b46b1cdd7747250d2ba10 |
| publicationDate | 2016-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-9327108-B2 |
| titleOfInvention | Flexible circuit electrode array and a method for backside processing of a flexible circuit electrode device |
| abstract | A flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer. A method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate. Another aspect of the method involves backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate. |
| priorityDate | 2007-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.