| abstract |
There is provided provide a photosensitive resin composition which can markedly improve transparency, heat resistance, heat discoloration resistance, solvent resistance, and patterning properties. A photosensitive resin composition including: a polymer (A) in which a content of a unit structure containing a boronic acid group, a unit structure containing a boronic acid ester group, or a combination of these unit structures is 20 mol % to 100 mol % of a total molar number of unit structures constituting the polymer; and a photosensitizer (B). The polymer (A) preferably has a weight average molecular weight of 1,000 to 50,000. A cured film obtained from the photosensitive resin composition. A microlens prepared from the photosensitive resin composition. |