| abstract |
A polyamide composition which provides moldings having a significantly reduced percolation threshold and an improved electrical conductivity is provided. The composition contains a) at least 40 parts by weight of a polyamide; b) from 0.15 to 25 parts by weight of an electrically conductive carbon; c) from 0.3 to 8 parts by weight of an oligofunctional compound; and, optionally, d) conventional auxiliaries and additives, wherein the electrically conductive carbon comprises at least one of carbon nanotubes and graphene, the oligofunctional compound comprises at least one functional group reactive with reactive groups on a surface of the electrically conductive carbon and at least one functional group reactive with an end group of the polyamide, and the sum of the parts by weight of the components a) to d) is 100. |