| abstract |
An IR imaging system comprising microelectromechanical systems (MEMS) differential capacitive infrared sensors within a sensor array formed on a monolithic integrated circuit substrate, or flip chip bonded onto a signal processing chip fabricated separately, to include, a bimaterial deflectable element anchored to the substrate, a surface electrode fabricated on a top surface of the substrate and positioned below the deflectable element, the surface electrode and the deflectable element separated by a gap to form a first variable capacitor, a sealing ring surrounding the deflectable element and the surface electrode, an infrared transparent sealing cap electrode coupled to the sealing ring to form a vacuum cavity around the deflectable element and the surface electrode, the deflectable element and the sealing cap electrode separated by a gap to form a second variable capacitor and a micro-lens fabricated on the sealing cap electrode to focus the infrared radiation onto the bimaterial deflectable element. |