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filingDate 2014-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2016-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9281212-B1
titleOfInvention Dielectric tone inversion materials
abstract A process for patterning a hard mask material with line-space patterns below a 30 nm pitch and a 15 nm critical dimension by employing a spin-on titanium-silicon (TiSi) polymer or oligomer as a tone inversion material is provided. The spin-on TiSi material is spin-coated over a patterned OPL that includes a first pattern generated from a DSA based process. The spin-on TiSi material fill trenches within the patterned OPL to form a tone inverted pattern by removing the patterned OPL selective to the spin-on TiSi material. The inverted pattern is a complementary pattern to the first pattern, and is transferred into the underlying hard mask material by an anisotropic etch.
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