Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16176 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16172 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06135 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1515 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05553 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-045 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-20 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66 |
filingDate |
2013-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c02d34dc6818bf958a3f6fc12a53ecb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_676908b32b4b7e58c53f48ebc76225ec |
publicationDate |
2015-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9177881-B2 |
titleOfInvention |
High-frequency semiconductor package and high-frequency semiconductor device |
abstract |
Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity. |
priorityDate |
2013-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |