Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1316 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-535 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-535 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-06 |
filingDate |
2014-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44abbaa7d7fb0bf5ca221b5ab0b16048 |
publicationDate |
2015-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9162874-B2 |
titleOfInvention |
Semiconductor structure and method forming the same |
abstract |
A semiconductor structure having a micro electromechanical system (MEMS) device is provided. The MEMS device includes a first and a second type electrical terminal, and a semiconductor interconnector. The semiconductor interconnector connects the first type electrical terminal with an external circuitry through a conductor. The conductor serves to electrically connecting the semiconductor interconnector with the first type electrical terminal. The second type electrical terminal surrounds the first type electrical terminal. In addition, the second type electrical terminal is interposed between the semiconductor interconnector and the first type electrical terminal. An isolative layer is provided around the conductor. The isolative layer is positioned under the first type electrical terminal, the second type electrical terminal and the semiconductor interconnector. |
priorityDate |
2014-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |