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filingDate 2013-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a56f8ea62840d6bc8801bb73fefc9032
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publicationDate 2015-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9145607-B2
titleOfInvention Tandem source activation for cyclical deposition of films
abstract A method includes flowing reactant gases into a process chamber. Plasma having a first power level is supplied using a plasma source. The process chamber is dosed with the precursor. The first power level is sufficient to enhance adsorption of the precursor on a surface of the substrate and is insufficient to decompose the precursor that is adsorbed. After a first predetermined period, the method includes removing a portion of the precursor that does not adsorb onto the substrate. The precursor that is adsorbed is activated using plasma having a second power level using the plasma source. The second power level is greater than the first power level and is sufficient to decompose the precursor.
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