| abstract |
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. n A temporary bonding agent 55 is applied onto multiple substrates 50 a , 50 b , and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50 a , 50 b are bonded with solder with the melted solder 54 interposed therebetween. |