| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af9a57049d2d91c036d4f5ab49154cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_827f58bacb8fef905977e1f8b3c7aace
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_52cf78c1726ef9be675a72f56e49a463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76804 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2014-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ce69cfcf3cff8c77ac0e146c6111a05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00f217cbb5adc270f32a7900b4c54324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d8ff28da16f2fa858c937520e61c167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81a2c5f3efc03879e2c158a6280af9e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a36c6bc9d149732923960ac3e785fa3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef250d1d711f1d9c9ac4b25290eca43b |
| publicationDate |
2015-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9111938-B2 |
| titleOfInvention |
Copper interconnect with CVD liner and metallic cap |
| abstract |
A structure having a diffusion barrier positioned adjacent to a sidewall and a bottom of an opening being etched in a layer of dielectric material. The structure also having a metal liner positioned directly on top of the diffusion barrier, a seed layer positioned directly on top of the metal liner, wherein the seed layer is made from a material comprising copper, a copper material positioned directly on top of the seed layer, a metallic cap positioned directly on top of and selective to the copper material, and a capping layer positioned directly on top of and adjacent to the metallic cap. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012114869-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9293417-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10651125-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11251126-B2 |
| priorityDate |
2012-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |