Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f47985b7c371b565f319708450999686 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2013-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff2a51f6be390ed02455354381571201 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51fac521e38386255433ad01de5dcbfc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06321e5058be344d590e7d6dc97a1441 |
publicationDate |
2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9105644-B2 |
titleOfInvention |
Apparatus and method for forming alignment features for back side processing of a wafer |
abstract |
A method for forming an alignment feature for back side wafer processing in a wafer fabrication process involves forming a trench into but not entirely through a wafer from a top side of the wafer; forming a contrasting material on surfaces of the trench; and grinding a bottom side of the wafer to expose the trench using the handling wafer to handle the wafer during such grinding, wherein the contrasting material lining the exposed trench provides an alignment reference for precise alignment of the wafer for back side processing the wafer. |
priorityDate |
2013-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |