patent/US-9105532-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9105532-B2

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c1e49aee5e8b4d0893942406354c171
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81201 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05611 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03912 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13113 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05639 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1357 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13611 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11906 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13609 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
filingDate	2014-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40ae08ecfd7b186ac0546e6d3b1232a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea8a5adba1bfcd19403a88b76a597518
publicationDate	2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-9105532-B2
titleOfInvention	Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure
abstract	A semiconductor device has a semiconductor die with a first conductive layer formed over the die. A first insulating layer is formed over the die with a first opening in the first insulating layer disposed over the first conductive layer. A second conductive layer is formed over the first insulating layer and into the first opening over the first conductive layer. An interconnect structure is constructed by forming a second insulating layer over the first insulating layer with a second opening having a width less than the first opening and depositing a conductive material into the second opening. The interconnect structure can be a conductive pillar or conductive pad. The interconnect structure has a width less than a width of the first opening. The second conductive layer over the first insulating layer outside the first opening is removed while leaving the second conductive layer under the interconnect structure.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11749576-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11410977-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11272618-B2
priorityDate	2011-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009026634-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6372545-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3761309-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006087039-A1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID77987 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129581052 http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID1520600 http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID1520600

Total number of triples: 93.