| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c15e62d56310375771d0179b9887a816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_04ed45ce45e58f237cec7a815169254a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98814f30d21878126a7988d2a3f6fef5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-095 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
2012-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f37c1b189c7cc906bd37f93442633115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_162e0553ff5ea7ec98d35353356a40a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b6ef7cb92c0caf757b036461fd056a2 |
| publicationDate |
2015-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9091921-B2 |
| titleOfInvention |
Layered structure and photosensitive dry film to be used therefor |
| abstract |
In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9383647-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015168839-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10860772-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016338195-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019179995-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9775237-B2 |
| priorityDate |
2010-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |