patent/US-9087873-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9087873-B2

Outgoing Links

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filingDate	2014-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2015-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af5e18cc5109ad418e554dde59dca238
publicationDate	2015-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-9087873-B2
titleOfInvention	Semiconductor device manufacturing method
abstract	A recessed portion is formed around an outer edge of a device wafer at a peripheral edge portion of a first face of the device wafer. A recessed portion is formed around an outer edge of a support substrate, at a bonding face of the support substrate. The first face of the device wafer and the bonding face of the support substrate are bonded together by an adhesive. The device wafer is ground from a second face side, on the opposite side to the first face 11 , as far as a depth position to reach a bottom face of the recessed portion.
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priorityDate	2013-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 54.