| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_903d60aeb3df65f041a64bf47e90f74a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6e0f37c3b1f5a879c8996782cdae8cde
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ae5a5331c7dfaed06d078010cd5e1941
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7fb888780915b9de1e6918360f68c6a9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-403 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 |
| filingDate |
2010-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be1a1ad5011e862f77cc1b69d2e0ea6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c60e3876c07a743215b8c387690c03dd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aeb88c6c3512cff09005bf4e9a1f7211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff5065bc9860bb5d055fc25419c0b96b |
| publicationDate |
2015-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9062388-B2 |
| titleOfInvention |
Method and apparatus for controlling and monitoring the potential |
| abstract |
An electroplating apparatus including a reference electrode to control the potential during an electro-deposition process. The electroplating apparatus may include a bath containing a plating electrolyte and an anode present in a first portion of the bath containing the plating electrolyte. A cathode is present in a second portion of the bath containing the plating electrolyte. A reference electrode is present at a perimeter of the cathode. The electroplating apparatus also includes a control system to bias the cathode and the anode to provide a potential. A measuring system is provided in electrical communication with the reference electrode to measure the potential of the cathode. Methods of using the above described electroplating apparatus are also provided. Structures and method for electroless deposition are also provided. |
| priorityDate |
2010-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |