Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0cdb88d7577707b85ff2721c34d1cc83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af7366f6855cf2fae4733e05dfd0d53c http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ef09fc1cfda8149b8a6fca5a84d0d668 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d013cae52b12091142073c55da6e0c8 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1412 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2012-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fdd5ca49dfa840173921390cbfa1211 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddabe71215b6c32be095713f186c6cc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_888b146282921e1f539feeed37e1c7bd |
publicationDate |
2015-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9054081-B2 |
titleOfInvention |
Semiconductor device having through-substrate via with insulating portion |
abstract |
A semiconductor device includes an isolation portion penetrating a semiconductor substrate from a first surface to a second surface positioned opposite the first surface. The isolation portion includes a first insulating film and a second insulating film. The first insulating film has a slit portion at a side of the first surface and the slit portion is buried with the second insulating film. The semiconductor device further includes an electrode penetrating the semiconductor substrate that is surrounded by the isolation portion. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11152319-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10312143-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019139917-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9941165-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11621219-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10283471-B1 |
priorityDate |
2011-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |