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publicationNumber US-9045328-B2
titleOfInvention Method for wafer-level surface micromachining to reduce stiction
abstract An array of microbumps with a layer or coating of non-superhydrophobic material yields a superhydrophobic surface, and may also have a contact angle hysteresis of 15 degrees or less. A surface with such an array may therefore be rendered superhydrophobic even though the surface structure and materials are not, by themselves, superhydrophobic.
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