| abstract |
A polyamide composition for surface-mounted components is described. Also described are compositions for surface-mounted components (SMCs) including a semiaromatic polyamide modified by a hydroxyaromatic compound, reinforcing fillers, and a flame retardant. Further, the compositions have many advantages linked to the uses thereof in lead-free reflow soldering processes, in particular a good dimensional stability and a blistering resistance during the use of articles produced from these compositions. |