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publicationDate 2015-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9001523-B2
titleOfInvention Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer
abstract A method for patterning a layer stack with at least one ceramic layer includes providing the ceramic layer, which has at least one plated-through hole. An electrically conductive layer is applied above the ceramic layer, such that the electrically conductive layer is electrically coupled to the at least one plated-through hole. A further layer is deposited onto the electrically conductive layer in the region of the at least one plated-through hole, wherein the further layer includes nickel. The electrically conductive layer is removed outside the region of the at least one plated-through hole. A carrier device patterned in this way can be electrically and mechanically coupled to an electronic component.
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