| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f285bc7936cdd34b2fa46a42013a3460
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_39217822741e7e29eb936ff5d868bd83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b968e636aefdc7f7e4793b09cfc03100 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-053 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
| filingDate |
2008-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d03e45ba1a433b89065d237cec28f59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0610a8c310cbb237980ac81db5f24f1a |
| publicationDate |
2015-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8987769-B2 |
| titleOfInvention |
High thermal performance packaging for optoelectronics devices |
| abstract |
A novel submount for the efficient dissipation of heat away from a semiconductor light emitting device is described, which also maintains efficient electrical conductivity to the n and p contacts of the device by separating the thermal and electrical conductivity paths. The submount comprises at least the following constituent layers: a substrate ( 400 ) with thermally conductive properties; a deposited layer ( 402 ) having electrically insulating and thermally conducting properties disposed on at least a region of the substrate having a thickness of between 50 nm and 50 microns; a patterned electrically conductive circuit layer ( 404 ) disposed on at least a region of the deposited layer; and, a passivation layer at least partially overcoating a top surface of the submount. Also described is a light emitting module employing the substrate and a method of manufacture of the submount. |
| priorityDate |
2007-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |